BID126007: 1st Payment of Bond Interest (from 03/2/2026 inclusive to 03/8/2026 exclusive)
Viet Nam Securities Depository and Clearing Corporation (VSDC) would like to announce the record date of corporate action processing for the Securities registering institution as follows:
- Payment rate: 3,372 VND/bond
- The actual number of days for calculating bond interest during the interest payment period (from 03/02/2026 inclusive to 03/8/2026 exclusive): 181 days.
- Bond interest is calculated using the following formula:
+ Interest earned = Face value of bonds held on the last registration date x 6.8% x 181/365.
+ The total amount of Bond interest received by the bondholder will be rounded to whole number (if the first dp is equal to or greater than 5, then the number is rounded up; if the first dp is less than 5 then the decimal part will be removed).
- Payment date: 03/8/2026
- Payment place:
+ The holders whose shares have been deposited will receive bond interest at the depository members (DMs) where they opened depository accounts.
+ The holders whose shares have not been deposited will receive bond interest at BIDV - Ha Thanh Branch from 03/8/2026. ID cards have to be presented
Coordination details and procedures for corporate action processing for holders of the above securities between VSDC, the Securities registering institution and depository members are specified in the Guideline on corporate action processing for securities holders at VSDC.
Joint Stock Commercial Bank for Investment and Development of Vietnam
and the parties involved in the process of preparing the dossier, documents of corporate action processin are fully responsible before the law for the legality, accuracy, truthfulness and completeness of the dossier; Institutions and individuals participating in the confirmation of records and documents shall be legally responsible within the scope related to such records and documents as prescribed in Clause 1, Article 11a of the Securities Law No. 54/2019/QH14 dated 26/11/2019, supplemented by Clause 4, Article 1 of Law No. 56/2024/QH15 dated 29/11/2024.
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BID126007: Bond registration
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